国家/地区 中国（75） 美国（2） 世界知识产权组织（2）
IPC部 H（75） C（22） B（15）
A（9） F（5） G（4）
IPC大类 H05（75）
IPC小类 H05K（38） H05B（37） B32B（7）
C01B（6） C08K（6） C08L（6）
C09D（5） C09K（5） A61N（4）
C08J（4） C23C（4） A47B（2）
A61F（2） B08B（2） B29C（2）
IPC H05B003/14（21） H05K007/20（16） H05B003/02（13）
H05K009/00（12） H05B003/06（7） H05B003/20（7）
H05B003/34（7） B32B009/00（6） B32B009/04（5）
C08K003/04（5） H05B001/02（5） A61N005/06（4）
B32B015/20（4） B32B038/00（4） H05B003/03（4）
发明人 WANG X（75）
公开年 2022（27） 2021（16） 2020（11） 2023（9） 2018（6） 2017（4）
申请年 2022（30）  2020（14）  2019（10）  2021（9）  2017（5）  2016（3）  2018（3） 
专利权人 QINGDAO GUAN.（6） BEIJING GRAP.（4） GUANGDONG NE.（4） GUANGDONG SU.（4）
FOSHAN SANSH.（3） DONGFANG ELE.（2） HANGZHOU CHA.（2） HEILONGJIANG.（2）
INNER MONGOL.（2） JIANGSU ZHAN.（2） OPPO GUANGDO.（2） UNIV NANJING.（2）

Connected graphene heating plate, has circuit series mechanism clamped by clamping mechanism, where graphene of heating plate is provided with group of unlocking mechanism, and card releasing mechanism is used for releasing mechanism.

MA Z, WANG X

Satellite surface wave-absorbing skin structure for satellite, has thermal control layer bonded to upper surface of wave-transmitting enhancement layer, wave-absorbing honeycomb layer, and reinforced shielding layer for isolating electromagnetic wave penetration on both sides of absorbing skin.

FU X, MI X, ZHANG H, WANG X, GAO W, XU Y

Preparing laser irradiation moving platform based zirconium dioxide-carbon wave-absorbing material, comprises irradiating UIO66-graphene oxide powder with pulsed laser in negative pressure closed environment.

QIN J, ZHANG G, WANG B, BAI X, WANG X

Preparing fluorinated graphene used as composite heat-conducting film, involves uniformly mixing oxidized graphene with polyvinylidene fluoride, calcining under protection of inert gas, and carrying out fluorination reaction.

GUO S, WANG X, ZHANG L, LIU Y, YUAN X, ZHANG G, HUO J

Photosensitive graphene slurry useful for heating device, comprises organic component (comprised of e.g. diluent, photoinitiator, photosensitizer, binder, organic solvent, and dispersant) and inorganic component (comprised of conductive functional phase, and sintering auxiliary agent).

WANG Y, LIU X, MO H, WANG X, LIU J, LV Q, XIE T, CHANG X, JI X

Heat conducting sheet for use in radiator, has graphene film and metal heat conducting film that are alternately arranged, where graphene film is provided with metal bonding film.

WANG X, LI J, SUN Q, ZHANG H

Graphene absorbing composite material i.e. wave absorbing material, for use in electronic technologies e.g. mobile devices, has nickel and/or cobalt formed as square-shaped structure and uniformly stacked on graphene sheet layer.

CHEN C, WANG X, CHEN G, FENG Y, CHEN Q, WANG Y, SU Y, LU S, ZHANG J, SUN Y, ZHANG P, HOU M, CHENG S, CHEN A, DU Z, MA Y

Single-sided copper-clad circuit board for solar energy, has circuit board main portion whose inner portion is fixedly installed with copper heat conducting column and top portion is covered with covering copper.

LI J, HUANG W, ZHOU P, WANG X, ZHU L, ZHU W

High density interconnected blind hole structure for circuit board, has top layer plate whose front and back surfaces are fixedly connected with radiating silica gel plate, where side opposite to gel plates is fixed with carbon fiber rod.

LI J, HUANG W, ZHOU P, WANG X, ZHU L, ZHU W

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z